孙学敏，中共党员，汉族，工学博士，副教授。主持教育厅高校创新基金项目1项，参与国家自然科学基金项目3项，指导学生完成大学生科研项目2项，在《MATERIALS TODAY COMMUNICATIONS》、《Journal of Materials Science》等国内外期刊发表SCI论文7篇，获得兰州文理学院“科研之星”荣誉称号。主要研究方向：1、先进材料连接技术；2、材料表面改性技术。
发表论文：
(1) Sun Xuemin, Yu Weiyuan, Wu Baolei, Yang Guoqing. Kinetics of Dissolution of Copper in Liquid Tin With Ultrasonic Waves[J]. Materials Research. 2020, 23(1): e20190392.
(2) 孙学敏,俞伟元,吴保磊,杨国庆,刘赟.直流电作用下铜在液态锡里的溶解动力学[J].稀有金属材料与工程.2020,49(10):3425-3432.
(3) XUEMIN SUN; WEIYUAN YU; YANHONG WANG ; Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin, Journal of ELECTRONIC MATERIALS , 2020, 79(11):6590-6597.
(4) Xuemin Sun; Weiyuan Yu; Fengfeng Wang; Yanhong Wang ; Effect of ultrasonic vibration on the wetting behavior of molten tin on copper substrate, Journal of Materials Science: Materials in Electronics , 2021, 32(1): 1073-1079.
(5) Sun Xuemin; Yu Weiyuan; Wang Fengfeng; Wu Baolei; Wang Yanhong ; Effect of Ultrasonic Vibration Coupled with Direct Current on Wetting Behavior, 稀有金属材料与工程 , 2022, 51(3): 800-805.
(6) Sun Xuemin; Yu, Weiyuan; Wu, Baolei; Zhu, Weiwei ; Study on the wettability of Sn/Cu system under ultrasonic vibration, MATERIALS TODAY COMMUNICATIONS , 2024, 40: 109706.
(7) Sun Xuemin, Zhu Weiwei, Yu Weiyuan, et al. Effect of Direct Current on Wetting of Cu Substrate in Liquid Sn Solder[J]. Rare Metal Materials and Engineering, 2025, 54(06): 1445-1450.
